Heating Desoldering Platform for iPhone X to 17Pro Max Motherboard Layering

Description

Qianli F1X Smart Curved Heating Desoldering Platform for iPhone X to 17Pro Max Motherboard Layering

Features:
Smart curve heating station with integrated smart desoldering/heating capabilities, offering precision, temperature control, curve control, and versatility for multiple scenarios.
Large 60×90 mm heating platform with precise temperature control and adjustable clamps for flexible, multi-directional positioning.
Curve-based temperature control enables more precise management of the desoldering process; supports multi-point temperature settings to ensure heating, constant temperature maintenance, and cooling align with repair workflows.
The 60×90 mm large heating area covers mainstream smartphone motherboard repair scenarios, ensuring more uniform heat distribution across a larger surface
Multi-directional adjustable clamping reduces operational misalignment; the multi-directional clamping structure accommodates motherboards and modules of various sizes
The middle-layer heating module features a gap-avoidance design to prevent solder explosions, making repairs more convenient and faster
Temperature and curve modes are clearly displayed, allowing for quick completion of common operations
Large screen with a wide field of view; one-touch mode switching; multiple temperature settings for desoldering and soldering